APW7153B Ver la hoja de datos (PDF) - Anpec Electronics

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componentes Descripción

Fabricante

APW7153B

3A 5V 2MHz Synchronous Buck Converter

Anpec Electronics 

APW7153/A/B

Ordering and Marking Information

APW7153/A/B

Assembly Material

Handling Code

Temperature Range

Package Code

Package Code

QB : TDFN3x3-10 KA : SOP-8P

Operating Ambient Temperature Range

I : -40 to 85 oC

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

APW7153/A/B QB:

APW

7153

XXXXX

APW

7153A

XXXXX

APW

7153B

XXXXX

XXXXX - Date Code

APW7153 KA:

APW7153

XXXXX

XXXXX - Date Code

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Absolute Maximum Ratings (Note 1)

Symbol

Parameter

Rating

Unit

VVDD, VPVDD Input Supply Voltage

-0.3 ~ 6

V

VLX

LX to GND Voltage

>20ns pulse width

-1 ~VPVDD+0.3

V

<20ns pulse width

-3 ~VPVDD+3

V

SHDN/RT, FB, COMP, POK to GND Voltage

-0.3 ~ 6

V

PGND

PGND to GND Voltage

-0.3 ~ +0.3

V

PD

TJ

TSTG

TSDR

Power Dissipation

Junction Temperature

Storage Temperature

Maximum Lead Soldering Temperature, 10 Seconds

Internally Limited

W

150

oC

-65 ~ 150

oC

260

oC

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Thermal Characteristics

Symbol

θJA

θJC

Parameter

Junction-to-Ambient Resistance in Free Air (Note 2)

Junction-to-Case Resistance in Free Air (Note 3)

TDFN3x3-10

SOP-8P

TDFN3x3-10

SOP-8P

Typical Value

50

80

10

20

Unit

oC/W

oC/W

Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad

of TDFN3x3-10 and SOP-8P is soldered directly on the PCB.

Note 3: The case temperature is measured at the center of the exposed pad on the underside of the TDFN3x3-10 and SOP-8P

packages.

Copyright © ANPEC Electronics Corp.

2

Rev. A.6 - Aug., 2012

www.anpec.com.tw

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