APL5910 Ver la hoja de datos (PDF) - Anpec Electronics

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componentes Descripción

Fabricante

APL5910

1A, Ultra Low Dropout (0.12V Typical) Linear Regulator

Anpec Electronics 

APL5910

Ordering and Marking Information

APL5910

Assembly Material

Handling Code

Temperature Range

Package Code

Package Code

KA : SOP-8P

Operating Ambient Temperature Range

I : -40 to 85 oC

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

APL5910 KA :

APL5910

XXXXX

XXXXX - Date Code

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Absolute Maximum Ratings

Symbol

Parameter

Rating

Unit

VCNTL

VCNTL Supply Voltage (VCNTL to GND)

-0.3 ~ 6

V

VIN

VIN Supply Voltage (VIN to GND)

-0.3 ~ 6

V

VOUT

VOUT to GND Voltage

-0.3 ~ VIN+0.3

V

POK to GND Voltage

-0.3 ~ 7

EN, FB to GND Voltage

-0.3 ~ VCNTL+0.3

V

PD

Power Dissipation

TJ

Maximum Junction Temperature

TSTG

Storage Temperature Range

TSDR

Maximum Lead Soldering Temperature, 10 Seconds

2.5

W

150

οC

-65 ~ 150

οC

260

οC

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

Junction-to-Ambient Resistance in Free Air (Note 1)

θJA

50

SOP-8P

oC/W

Junction-to-Case Resistance in Free Air (Note 2)

θJC

20

SOP-8P

oC/W

Note 1: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.

Note 2: The “Thermal-Pad Temperature” is measured on the PCB copper area connected to the thermal pad of package.

1

2

3

4

PCB Copper

8

7

6

5

Measured Point

Copyright © ANPEC Electronics Corp.

2

Rev. A.3 - Jun., 2009

www.anpec.com.tw

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