APL5913 Ver la hoja de datos (PDF) - Anpec Electronics
Número de pieza
componentes Descripción
Fabricante
APL5913 Datasheet PDF : 19 Pages
| |||
APL5913
Absolute Maximum Ratings
Symbol
Parameter
VCNTL
VCNTL Supply Voltage (VCNTL to GND)
VIN
VIN Supply Voltage (VIN to GND)
VI/O
EN and FB to GND
VPOK
POK to GND
PD
Average Power Dissipation
PPEAK
Peak Power Dissipation (<20mS)
TJ
Junction Temperature
TSTG
Storage Temperature
TSDR
Soldering Temperature, 10 Seconds
VESD
Minimum ESD Rating (Human Body Mode)
Thermal Characteristics
Rating
-0.3 ~ 7
-0.3 ~ 3.3
-0.3 ~ VCNTL+0.3
-0.3 ~ 7
3
20
150
-65 ~ 150
300
±2
Unit
V
V
V
V
W
W
oC
oC
oC
kV
Symbol
Parameter
Value
θJA
Junction-to-Ambient Thermal Resistance in Free Air (Note)
40
Note : θJA is measured with the component mounted on a high effective thermal conductivity test
board in free air. The exposed pad of SOP-8-P is soldered directly on the PCB.
Recommended Operating Conditions
Unit
oC/W
Symbol
VCNTL
VIN
VOUT
IOUT
TJ
Parameter
VCNTL Supply Voltage
VIN Supply Voltage
Output Voltage
VOUT Output Current
Junction Temperature
VCNTL=3.3±5%
VCNTL=5.0±5%
Range
3.1 ~ 6
1.1 ~ 3.3
0.8 ~ 1.2
0.8 ~ VIN-0.2
0~4
-25 ~ 125
Unit
V
V
V
A
oC
Electrical Characteristics
Refer to the typical application circuit. These specifications apply over, VCNTL = 5V, VIN = 1.5V, VOUT = 1.2V and TA = 0
to 70°C, unless otherwise specified. Typical values refer to TA = 25°C.
Symbol
Parameter
Test Conditions
SUPPLY CURRENT
ICNTL
VCNTL Nominal Supply Current
ISD
VCNTL Shuntdown Current
EN = VCNTL
EN = GND
APL5913
Unit
Min Typ Max
0.4
1
8
mA
180 300 µA
Copyright © ANPEC Electronics Corp.
4
Rev. A.4 - May., 2005
www.anpec.com.tw
Share Link: 