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APL5913 Ver la hoja de datos (PDF) - Anpec Electronics

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APL5913 Datasheet PDF : 19 Pages
First Prev 11 12 13 14 15 16 17 18 19
APL5913
Application Information (Cont.)
PCB Layout Considerations (Cont.)
CCNTL
VC N T L
VCNTL
VIN
A PL5913
VOUT
VOUT
C1
FB
GND
R2
CIN
COUT
R1
VIN
VO U T
Load
Figure 2
Thermal Considerations
See Figure 3. The SOP-8-P is a cost-effective package
featuring a small size like a standard SOP-8 and a
bottom exposed pad to minimize the thermal resistance
of the package, being applicable to high current
applications. The exposed pad must be soldered to
the top VIN plane. The copper of the VIN plane on the
Top layer conducts heat into the PCB and air. Please
enlarge the area to reduce the case-to-ambient resistance
(θCA).
10 2 m i l
118 mil
1
8
2
7
SOP-8-P
3
6
4
5
Ambient
Air
Top
VOUT
plane
Exposed
Die Pad
Top
VIN
plane
PCB
Figguurree43
Copyright © ANPEC Electronics Corp.
15
Rev. A.4 - May., 2005
www.anpec.com.tw

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