APL5912
Application Information (Cont.)
Thermal Considerations
See Figure 3. The SOP-8-P is a cost-effective package
featuring a small size like a standard SOP-8 and a
bottom exposed pad to minimize the thermal resistance
of the package, being applicable to high current
applications. The exposed pad must be soldered to
the top VIN plane. The copper of the VIN plane on the
Top layer conducts heat into the PCB and air. Please
enlarge the area to reduce the case-to-ambient resistance
(θCA).
102 mil
118 mil
1
8
2
7
SOP-8-P
3
6
4
5
Ambient
Air
Top
VOUT
plane
Exposed
Die Pad
Top
V IN
plane
PCB
Figure 3
Copyright © ANPEC Electronics Corp.
15
Rev. A.6 - Jun., 2005
www.anpec.com.tw