APL5331 Ver la hoja de datos (PDF) - Anpec Electronics
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Fabricante
APL5331 Datasheet PDF : 23 Pages
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APL5331
Ordering and Marking Information
APL5331
APL5331 K :
APL5331 KA :
Assembly Material
Handling Code
Temperature Range
Package Code
APL5331
XXXXX
Package Code
K : SOP-8
KA : SOP-8P
U5 : TO-252-5 G5 : TO-263-5
Operating Ambient Temperature Range
C : 0 to 70 oC
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device
G : Halogen and Lead Free Device
XXXXX - Date Code
APL5331 U5 :
APL5331 G5 :
APL5331
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings
Symbol
VCNTL
VIN
PD
TJ
TSTG
TSDR
Parameter
VCNTL Supply Voltage, VCNTL to GND
VIN Supply Voltage, VIN to GND
Power Dissipation
Junction Temperature
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Rating
Unit
-0.2 ~ 7
V
-0.2 ~ 3.9
V
Internally Limited
W
150
oC
-65 ~ 150
oC
260
oC
Thermal Characteristics
Symbol
Parameter
Value
Unit
Junction-to-Ambient Thermal Resistance in Free Air
SOP-8
75
θJA
SOP-8P
55
oC/W
TO-252-5
42
TO-263-5
34
Junction-to-Case Thermal Resistance
SOP-8
28
θJC
SOP-8P
20
oC/W
TO-252-5
12
TO-263-5
11
Note : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
of SOP-8P is soldered directly on the PCB.
Copyright © ANPEC Electronics Corp.
2
Rev. B.4 - Mar., 2008
www.anpec.com.tw
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