AO4946 Ver la hoja de datos (PDF) - Alpha and Omega Semiconductor
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AO4946 Datasheet PDF : 5 Pages
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III. Result of Reliability Stress for AO4946 (Standard) & AO4946L (Green)
Continues
DPA
Internal Vision
NA
Cross-section
5
5
0
5
5
X-ray
5
5
CSAM
NA
5
5
0
Bond Integrity Room Temp
150°c bake
150°c bake
0hr
250hr
500hr
40
40 wires
0
40
40 wires
40
40 wires
Solderability 245°c
5 sec
15
15 leads
0
Die shear
150°c
0hr
10
10
0
Note A: The HTGB and HTRB reliability data presents total of available AO4946 and AO4946L
burn-in data up to the published date.
Note B: The pressure pot, temperature cycle and HAST reliability data for AO4946 and AO4946L
comes from the AOS generic package qualification data.
IV. Reliability Evaluation
FIT rate (per billion): 128
MTTF =891 years
In general, 500 hrs of HTGB, 150 deg C accelerated stress testing is equivalent to 15 years of
lifetime at 55 deg C operating conditions (by applying the Arrhenius equation with an activation
energy of 0.7eV and 60% of upper confidence level on the failure rate calculation). AOS reliability
group also routinely monitors the product reliability up to 1000 hr at and performs the necessary
failure analysis on the units failed for reliability test(s).
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AO4946). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2 (164) (168) (258)] = 128
MTTF = 109 / FIT =7.81 x 106hrs = 891 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C
150 deg C
Af
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
4
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