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AN209 Datasheet PDF : 14 Pages
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AN 209: Using Terminator Technology in Stratix & Stratix GX Devices
When you enable Terminator technology for an I/O bank, the external
reference resistors for that bank are activated. When enabled, these
reference resistors also draw a finite amount of current. The current
consumption of these resistors for different I/O standards is shown in the
Table 7.
f
Table 7. RUP & RDN Current Consumption Note (1)
Bank I/O Standard
Selected by Terminator
Technology
LVTTL/LVCMOS (3)
LVTTL/LVCMOS (3)
SSTL-2 class I
SSTL-2 class II
SSTL-3 class I
SSTL-3 class II
HSTL class I
HSTL class II
GTL
GTL+
CTT
RUP & RDN Current Consumption
per I/O Bank (Iref in mA) (2)
Series
Termination
Parallel
Termination
16
N/A
10
N/A
9
13
12
14
15
22
19
26
N/A
5
N/A
5
N/A
17
N/A
17
N/A
24
VCCIO (V)
3.3
2.5
2.5
2.5
3.3
3.3
1.5
1.5
3.3
3.3
3.3
Notes to Table 7:
(1) There are no current restrictions for the HSTL class I and class II I/O standards
(thermally-enhanced BGA cavity-up packages).
(2) Iref is the current drawn by the Terminator technology control circuitry, including
the external reference resistors RUP and RDN, per I/O bank.
(3) These values are the same whether you are using 250- or 500-Ω reference resistors.
Dual-purpose pins for connecting external reference resistors are also
included while counting ten consecutive I/O pins. When using
Terminator technology, Figure 7 shows a Stratix or Stratix GX device’s
current draw limitation guidelines.
For complete details on the current draw limits or any other limitations for
different I/O standards, refer to AN 201: Using Selectable I/O Standards in
Stratix Devices.
10
Altera Corporation
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