Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits
English
í•œêµì–´
日本語
руÑÑкий
简体ä¸æ–‡
español
Número de pieza
componentes Descripción
CXK582000TM Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXK582000TM
262144-word × 8-bit High Speed CMOS Static RAM
Sony Semiconductor
CXK582000TM Datasheet PDF : 11 Pages
1
2
3
4
5
6
7
8
9
10
Package Outline
Unit: mm
CXK582000TM
32PIN TSOP (
I
) (PLASTIC)
8.0 ± 0.2
32
17
+ 0.2
1.07 – 0.1
0.1
0.1 ± 0.1
+ 0.08
1
0.2 – 0.03
0.08
M
16
0.5
A
+ 0.05
0.127
– 0.02
0° to 10°
DETAIL
A
CXK582000TM/YM/M
NOTE :
∗
NOT INCLUDE MOLD FINS.
SONY CODE
EIAJ CODE
JEDEC CODE
TSOP-32P-L01
TSOP032-P-0820-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY / PHENOL RESIN
SOLDER PLATING
42 ALLOY
CXK582000YM
32PIN TSOP (PLASTIC)
8.0 ± 0.2
17
32
+ 0.2
1.07 – 0.1
0.1
16
+ 0.08
0.2 – 0.03
0.08 M
1
0.5
A
0.1 ± 0.1
+ 0.05
0.127 –
0.02
0° to 10°
NOTE > Dimension “
∗
†does not include mold protrusion.
DETAIL
A
PACKAGE STRUCTURE
SONY CODE
EIAJ CODE
JEDEC CODE
TSOP-32P-L01R
TSOP032-P-0820-B
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
42 ALLOY
0.3g
– 10 –
Share Link:
datasheetq.com [
Privacy Policy
]
[
Request Datasheet
] [
Contact Us
]