AM29LV200BB-70RDFI Ver la hoja de datos (PDF) - Advanced Micro Devices
Número de pieza
componentes Descripción
Fabricante
AM29LV200BB-70RDFI
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1
Advanced Micro Devices
AM29LV200BB-70RDFI Datasheet PDF : 11 Pages
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SUPPLEMENT
PAD DESCRIPTION (RELATIVE TO VCC)
Pad Center (mils)
Pad
Signal
X
Y
1
VCC
0.00
0.00
2
DQ4
–12.10
0.00
3
DQ12
–18.00
0.00
4
DQ5
–23.90
0.00
5
DQ13
–29.80
0.00
6
DQ6
–35.60
0.00
7
DQ14
–41.50
0.00
8
DQ7
–47.40
0.00
9
DQ15/A–1
–53.30
0.00
10
VSS
–62.70
–1.50
11
BYTE#
–62.70
–11.60
12
A16
–62.70
–21.70
13
A15
–62.40
–112.50
14
A14
–55.00
–112.50
15
A13
–49.60
–112.50
16
A12
–43.80
–112.50
17
A11
–38.40
–112.50
18
A10
–32.50
–112.50
19
A9
–27.10
–112.30
20
A8
–21.20
–112.50
21
WE#
–15.70
–112.50
22
RESET#
–6.20
–116.30
23
RY/BY#
11.10
–116.30
24
Not Connected
N/A
N/A
25
A7
28.90
–112.50
26
A6
34.30
–112.50
27
A5
40.20
–112.50
28
A4
45.60
–112.50
29
A3
51.40
–112.50
30
A2
56.80
–112.50
31
A1
64.20
–112.50
32
A0
64.50
–21.90
33
CE#
64.50
–11.80
34
VSS
64.50
–1.70
35
OE#
55.10
0.90
36
DQ0
47.50
0.00
37
DQ8
41.60
0.00
38
DQ1
35.80
0.00
39
DQ9
29.80
0.00
40
DQ2
24.00
0.00
41
DQ10
18.10
0.00
42
DQ3
12.30
0.00
43
DQ11
6.30
0.00
Pad Center (millimeters)
X
Y
0.00
0.00
–0.31
0.00
–0.46
0.00
–0.61
0.00
–0.76
0.00
–0.90
0.00
–1.05
0.00
–1.20
0.00
–1.35
0.00
–1.59
–0.04
–1.59
–0.29
–1.59
–0.55
–1.58
–2.86
–1.40
–2.86
–1.26
–2.86
–1.11
–2.86
–0.98
–2.86
–0.83
–2.86
–0.69
–2.85
–0.54
–2.86
–0.40
–2.86
–0.16
–2.95
0.28
–2.95
N/A
N/A
0.73
–2.86
0.87
–2.86
1.02
–2.86
1.16
–2.86
1.31
–2.86
1.44
–2.86
1.63
–2.86
1.64
–0.56
1.64
–0.30
1.64
–0.04
1.40
0.02
1.21
0.00
1.06
0.00
0.91
0.00
0.76
0.00
0.61
0.00
0.46
0.00
0.31
0.00
0.16
0.00
Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment.
November 18, 2003
Am29LV200B Known Good Die
5
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