AM29LV116DT-70 Ver la hoja de datos (PDF) - Advanced Micro Devices

Número de pieza

componentes Descripción

Fabricante

AM29LV116DT-70

16 Megabit (2 M x 8-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory

Advanced Micro Devices 

DATA SHEET

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 6

Standard Products .................................................................... 6

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 7

Table 1. Am29LV116D Device Bus Operations ................................7

Requirements for Reading Array Data ..................................... 7

Writing Commands/Command Sequences .............................. 7

Program and Erase Operation Status ...................................... 8

Standby Mode .......................................................................... 8

Automatic Sleep Mode ............................................................. 8

RESET#: Hardware Reset Pin ................................................. 8

Output Disable Mode ................................................................ 8

Table 2. Am29LV116DT Top Boot Sector Address Table ................9

Table 3. Am29LV116DB Bottom Boot Sector Address Table .........10

Autoselect Mode ..................................................................... 11

Table 4. Am29LV116D Autoselect Codes (High Voltage Method) ..11

Sector Protection/Unprotection ............................................... 11

Temporary Sector Unprotect .................................................. 11

Figure 1. In-System Sector Protect/Unprotect Algorithms .............. 12

Figure 2. Temporary Sector Unprotect Operation........................... 13

Hardware Data Protection ...................................................... 13

Common Flash Memory Interface (CFI) . . . . . . . 13

Table 5. CFI Query Identification String ..........................................14

Table 6. System Interface String .....................................................14

Table 7. Device Geometry Definition ..............................................15

Table 8. Primary Vendor-Specific Extended Query ........................15

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 16

Reading Array Data ................................................................ 16

Reset Command ..................................................................... 16

Autoselect Command Sequence ............................................ 16

Byte Program Command Sequence ....................................... 16

Figure 3. Program Operation .......................................................... 17

Chip Erase Command Sequence ........................................... 17

Sector Erase Command Sequence ........................................ 18

Erase Suspend/Erase Resume Commands ........................... 18

Figure 4. Erase Operation............................................................... 19

Command Definitions ............................................................. 20

Table 9. Am29LV116D Command Definitions ...............................20

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 21

DQ7: Data# Polling ................................................................. 21

Figure 5. Data# Polling Algorithm ................................................... 21

RY/BY#: Ready/Busy# ........................................................... 22

DQ6: Toggle Bit I .................................................................... 22

DQ2: Toggle Bit II ................................................................... 22

Reading Toggle Bits DQ6/DQ2 ............................................... 22

DQ5: Exceeded Timing Limits ................................................ 23

DQ3: Sector Erase Timer ....................................................... 23

Figure 6. Toggle Bit Algorithm........................................................ 23

Table 10. Write Operation Status ................................................... 24

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 25

Figure 7. Maximum Negative Overshoot Waveform ...................... 25

Figure 8. Maximum Positive Overshoot Waveform........................ 25

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 25

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 26

CMOS Compatible .................................................................. 26

Zero Power Flash ................................................................... 27

Figure 9. ICC1 Current vs. Time (Showing Active and

Automatic Sleep Currents) ............................................................. 27

Figure 10. Typical ICC1 vs. Frequency ........................................... 27

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Figure 11. Test Setup..................................................................... 28

Table 11. Test Specifications ......................................................... 28

Key to Switching Waveforms .................................................. 28

Figure 12. Input Waveforms and Measurement Levels ................. 28

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 29

Read Operations .................................................................... 29

Figure 13. Read Operations Timings ............................................. 29

Hardware Reset (RESET#) .................................................... 30

Figure 14. RESET# Timings .......................................................... 30

Erase/Program Operations ..................................................... 31

Figure 15. Program Operation Timings.......................................... 32

Figure 16. Chip/Sector Erase Operation Timings .......................... 32

Figure 17. Data# Polling Timings (During Embedded Algorithms). 33

Figure 18. Toggle Bit Timings (During Embedded Algorithms)...... 33

Figure 19. DQ2 vs. DQ6................................................................. 34

Temporary Sector Unprotect .................................................. 34

Figure 20. Temporary Sector Unprotect Timing Diagram .............. 34

Figure 21. Sector Protect/Unprotect Timing Diagram .................... 35

Figure 22. Alternate CE# Controlled Write Operation Timings ...... 37

Erase and Programming Performance . . . . . . . 38

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 38

TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 38

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 39

TS 040—40-Pin Standard TSOP ............................................ 39

Revision Summary 40

September 12,2006 21359E5

Am29LV116D

3

Share Link: