AIC1730 Ver la hoja de datos (PDF) - Analog Intergrations

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Fabricante

AIC1730

Low Noise Low Dropout, 150mA Linear Regulator

Analog Intergrations 

AIC1730

NOISE BYPASS CAPACITOR

Use a 0.1µF bypass capacitor at BP for low

output voltage noise. Increasing the capacitance

such as 1µF will decrease the output noise,

however, values above 1µF provide no

performance advantage and are not

recommended.

POWER DISSIPATION

The maximum power dissipation of AIC1730

depends on the thermal resistance of the case

and circuit board, the temperature difference

between the die junction and ambient air, and

the rate of air flow. The rate of temperature rise is

greatly affected by the mounting pad

configuration on the PCB, the board material,

and the ambient temperature. When the IC

mounting with good thermal conductivity is used,

the junction will be low even if the power

dissipation is great.

The power dissipation across the device is P =

IOUT (VIN-VOUT).

The maximum power dissipation is:

PMAX = (TJ-TA)/(θJB + θBA)

where TJ-TA is the temperature difference

between the die junction and the surrounding air,

θJB is the thermal resistance of the package, and

θBA is the thermal resistance through the PCB,

copper traces, and other materials to the

surrounding air.

As a general rule, the lower the temperature is,

the better the reliability of the device is. So the

PCB mounting pad should provide maximum

thermal conductivity to maintain low device

temperature.

The GND pin performs the dual function of

providing an electrical connection to ground and

channeling heat away. Therefore, connecting the

GND pin to ground with a large pad or ground

plane would increase the power dissipation and

reduce the device temperature.

100

COUT=1µF

10

100

COUT=2.2µF

10

1

STABLE REGION

0.1

1

STABLE REGION

0.1

0.01

0.01

50

100

150

50

100

150

IOUT(mA)

IOUT (mA)

10

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