ADSP-21161NKCA-100(RevA) Ver la hoja de datos (PDF) - Analog Devices
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ADSP-21161NKCA-100 Datasheet PDF : 60 Pages
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ADSP-21161N
25
20
15
10
5
NOMINAL
–5
0
Y = 0.0835X - 2.42
30
60
90
120
150 180
210
LOAD CAPACITANCE – pF
Figure 41. Typical Output Delay or Hold vs. Load
Capacitance (at Max Case Temperature)
16.0
14.0
12.0
10.0
Y = 0.0743X + 1.5613
RISE TIME
8.0
6.0
FALL TIME
Y = 0.0414X + 2.0128
4.0
2.0
0
0
20 40 60 80 100 120 140 160 180 200
LOAD CAPACITANCE – pF
Figure 42. Typical Output Rise/Fall Time (20% – 80%,
VDDEXT = Max)
16.0
14.0
12.0
Y = 0.0773X + 1.4399
RISE TIME
10.0
8.0
6.0
FALL TIME
Y = 0.0417X + 1.8674
4.0
2.0
0
0 20 40 60 80 100 120 140 160 180 200
LOAD CAPACITANCE – pF
Figure 43. Typical Output Rise/Fall Time (20% – 80%,
VDDEXT = Min)
Capacitive Loading
Output delays and holds are based on standard capacitive loads:
30 pF on all pins (see Figure 39 on Page 51). Figure 41 shows
graphically how output delays and holds vary with load capaci-
tance. (Note that this graph or derating does not apply to output
disable delays; see Output Disable Time on Page 51.) The graphs
of Figure 41, Figure 42, and Figure 43 may not be linear outside
the ranges shown for Typical Output Delay vs. Load Capacitance
and Typical Output Rise Time (20% – 80%, V = Min) vs. Load
Capacitance.
Environmental Conditions
The thermal characteristics in which the DSP is operating
influence performance.
Thermal Characteristics
The ADSP-21161N is packaged in a 225-ball Mini Ball Grid
Array (MBGA). The ADSP-21161N is specified for a case tem-
perature (TCASE). To ensure that the TCASE data sheet specification
is not exceeded, a heatsink and/or an air flow source may be used.
Use the center block of ground pins (MBGA balls: F6-10,
G6-10, H6-10, J6-10, K6-10) to provide thermal pathways to the
printed circuit board’s ground plane. A heatsink should be
attached to the ground plane (as close as possible to the thermal
pathways) with a thermal adhesive.
TCASE = TAMB + (PD × θCA)
where:
• TCASE = Case temperature (measured on top surface
of package)
• PD = Power dissipation in W (this value depends upon
the specific application; a method for calculating PD is
shown under Power Dissipation).
• θCA = Value from Table 38.
• θJB= 8.0°C/W
Table 38. Airflow Over Package Versus θCA
Airflow (Linear Ft./Min.)
θCA (°C/W)1
1 θJC = 6.8°C/W.
0
200 400
17.9 15.2 13.7
–52–
REV. A
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