ADP5023ACPZ-R7 Ver la hoja de datos (PDF) - Analog Devices

Número de pieza

componentes Descripción

Fabricante

ADP5023ACPZ-R7

Dual 3 MHz, 800 mA Buck Regulators with One 300 mA LDO

Analog Devices 

ADP5023

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

AVIN to AGND

VIN1, VIN2 to AVIN

PGND1, PGND2 to AGND

VIN3, VOUT1, VOUT2, FB1, FB2, FB3,

EN1, EN2, EN3, MODE to AGND

VOUT3 to AGND

SW1 to PGND1

SW2 to PGND2

Storage Temperature Range

Operating Junction Temperature

Range

Soldering Conditions

Rating

−0.3 V to +6 V

−0.3 V to +0.3 V

−0.3 V to +0.3 V

−0.3 V to (AVIN + 0.3 V)

−0.3 V to (VIN3 + 0.3 V)

−0.3 V to (VIN1 + 0.3 V)

−0.3 V to (VIN2 + 0.3 V)

−65°C to +150°C

−40°C to +125°C

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress rating

only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum

operating conditions for extended periods may affect product

reliability.

For detailed information on power dissipation, see the Power

Dissipation and Thermal Considerations section.

Data Sheet

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 7. Thermal Resistance

Package Type

24-Lead, 0.5 mm pitch LFCSP

θJA

θJC Unit

35

3

°C/W

ESD CAUTION

Rev. F | Page 6 of 28

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