ADP2302ARDZ-3.3-R7 Ver la hoja de datos (PDF) - Analog Devices
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ADP2302ARDZ-3.3-R7 Datasheet PDF : 28 Pages
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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
BST 1 ADP2302 8 SW
VIN 2 ADP2303 7 GND
EN 3 TOP VIEW 6 NC
PGOOD 4 (Not to Scale) 5 FB
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PAD SHOULD BE SOLDERED
TO AN EXTERNAL GROUND PLANE UNDERNEATH
THE IC FOR THERMAL DISSIPATION.
Figure 3. Pin Configuration (Top View)
ADP2302/ADP2303
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1
BST
Bootstrap Supply for the High-Side MOSFET Driver. A 0.1 μF capacitor is connected between SW and BST to
provide a floating driver voltage for the power switch.
2
VIN
Power Input. Connect to the input power source with a ceramic bypass capacitor to GND directly from this
pin.
3
EN
Output Enable. Pull this pin high to enable the output. Pull this pin low to disable the output. This pin can
also be used as a programmable UVLO input. This pin has an internal 1.2 μA pull-down current to GND.
4
PGOOD
Power-Good Open-Drain Output.
5
FB
Feedback Voltage Sense Input. For the adjustable version, connect this pin to a resistive divider from VOUT. For
the fixed output version, connect this pin to VOUT directly.
6
NC
Used for internal testing. Connect to GND or leave this pin floating to ensure proper operation.
7
GND
Ground. Connect this pin to the ground plane.
8
SW
Switch Node Output. Connect an inductor to VOUT and a catch diode to GND from this pin.
9 (EPAD) Exposed Pad The exposed pad should be soldered to an external ground plane underneath the IC for thermal dissipation.
Rev. 0 | Page 5 of 28
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