ADP1051 Ver la hoja de datos (PDF) - Analog Devices
Número de pieza
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Fabricante
ADP1051 Datasheet PDF : 108 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage (Continuous) VDD to AGND
Digital Pins (OUTA, OUTB, OUTC, OUTD,
SR1, SR2, PG/ALT, SDA, SCL) to AGND
PG/ALT, SDA, SCL to AGND
VS−, VS+, VF, OVP, RTD, ADD, CS1, CS2+, CS2−
to AGND
SYNI/FLGI, CTRL to AGND
Operating Temperature Range (TA)
Storage Temperature Range
Junction Temperature
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec)
RoHS-Compliant Assemblies (20 sec to
40 sec)
ESD Charged Device Model
ESD Human Body Model
Rating
4.2 V
−0.3 V to VDD + 0.3 V
−0.3 V to +3.9 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +125°C
−65°C to +150°C
150°C
240°C
260°C
1.25 kV
5.0 kV
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ADP1051
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
θJC
24-Lead LFCSP
36.26 1.51
Unit
°C/W
SOLDERING
It is important to follow the correct guidelines when laying out
the printed circuit board (PCB) footprint for the ADP1051 and
for soldering the part onto the PCB. For detailed information
about these guidelines, see the AN-772 Application Note, A Design
and Manufacturing Guide for the Lead Frame Chip Scale Package
(LFCSP).
ESD CAUTION
Rev. B | Page 9 of 108
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