ADN2850 Ver la hoja de datos (PDF) - Analog Devices
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ADN2850 Datasheet PDF : 28 Pages
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Data Sheet
ADN2850
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
VDD to GND
VSS to GND
VDD to VSS
VB, VW to GND
IB, IW
Pulsed 1
0F0F
Continuous
Digital Input and Output Voltage to GND
Operating Temperature Range 2
1F1F
Maximum Junction Temperature (TJ max)
Storage Temperature Range
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
Thermal Resistance
Junction-to-Ambient θJA,TSSOP-16
Junction-to-Ambient θJA,LFSCP-16
Junction-to-Case θJC, TSSOP-16
Package Power Dissipation
Rating
–0.3 V to +7 V
+0.3 V to −7 V
7V
VSS − 0.3 V to VDD + 0.3 V
±20 mA
±2 mA
−0.3 V to VDD + 0.3 V
−40°C to +85°C
150°C
−65°C to +150°C
215°C
220°C
150°C/W
35°C/W
28°C/W
(TJ max − TA)/θJA
1 Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2 Includes programming of nonvolatile memory.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. E | Page 7 of 28
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