ADL5365 Ver la hoja de datos (PDF) - Analog Devices

Número de pieza

componentes Descripción

Fabricante

ADL5365

1200 MHz to 2500 MHz, Balanced Mixer, LO Buffer, and RF Balun

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Supply Voltage, VS

RF Input Level

LO Input Level

IFOP, IFON Bias Voltage

VGS0, VGS1, LOSW, PWDN

Internal Power Dissipation

Maximum Junction Temperature

Operating Temperature Range

Storage Temperature Range

Lead Temperature Range (Soldering, 60 sec)

Rating

5.5 V

20 dBm

13 dBm

6.0 V

5.5 V

1.2 W

150°C

−40°C to +85°C

−65°C to +150°C

260°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is thermal resistance, junction to ambient (°C/W), and θJB is

thermal impedance, junction to board (°C/W).

Table 6. Thermal Resistance

Package Type

θJA1

20-Lead LFCSP

25

θJB1

14.74

Unit

°C/W

1 See the JEDEC standard, JESD51-2, for information on optimizing thermal

impedance (PCB with 3 × 3 vias).

ADL5365

Junction to Board Thermal Impedance

The junction to board thermal impedance (θJB) is the thermal

impedance from the die to or near the component lead of the

ADL5365. For the ADL5365, θJB is determined experimentally

to 14.74°C/W with the device mounted on a 4-layer circuit

board with two layers as ground planes in a configuration

similar to the ADL5365-EVALZ evaluation board. Board size

and complexity (number of layers) affect θJB; more layers tend to

reduce the thermal impedance slightly.

If the board temperature is known, use the junction to board

thermal impedance to calculate die temperature (also known as

junction temperature) to ensure it does not exceed the specified

limit of 150°C. For example if the board temperature is 85°C,

the die temperature is given by the equation

TJ = TB + (PDISS × θJB)

where TJ is the junction temperature.

TB is the board temperature measured at or near the

component lead.

PDISS is the power dissipated from the part.

The typical worst case power dissipation for the ADL5365 is

523 mW (5.5V × 97mA). Therefore TJ is

TJ = 85°C + (0.523 W × 14.74°C/W) = 92.9°C

ESD CAUTION

Rev. C | Page 5 of 24

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