AD9250 Ver la hoja de datos (PDF) - Analog Devices

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AD9250

14-Bit, 170 MSPS/250 MSPS, JESD204B, Dual Analog-to-Digital Converter

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

ELECTRICAL

AVDD to AGND

DRVDD to AGND

DVDD to DGND

VIN+A/VIN+B, VIN−A/VIN−B to AGND

CLK+, CLK− to AGND

RFCLK to AGND

VCM to AGND

CS, PDWN to AGND

SCLK to AGND

SDIO to AGND

RST to DGND

FDA, FDB to DGND

SERDOUT0+, SERDOUT0−,

SERDOUT1+, SERDOUT1− to AGND

SYNCINB+, SYNCINB− to DGND

SYSREF+, SYSREF− to AGND

ENVIRONMENTAL

Operating Temperature Range

(Ambient)

Maximum Junction Temperature

Under Bias

Storage Temperature Range

(Ambient)

Rating

−0.3 V to +2.0 V

−0.3 V to +2.0 V

−0.3 V to +2.0 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.3 V

−0.3 V to AVDD + 0.3 V

−0.3 V to AVDD + 0.3 V

−0.3 V to DVDD + 0.3 V

−0.3 V to DVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DVDD + 0.3 V

−0.3 V to AVDD + 0.3 V

−40°C to +85°C

150°C

−65°C to +125°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

AD9250

THERMAL CHARACTERISTICS

The exposed paddle must be soldered to the ground plane for

the LFCSP package. This increases the reliability of the solder

joints, maximizing the thermal capability of the package.

Table 7. Thermal Resistance

Package Type

Airflow

Velocity

(m/sec)

48-Lead LFCSP 0

7 mm × 7 mm 1.0

(CP-48-13)

2.5

θJA1, 2

25

22

20

θJC1, 3

2

θJB1, 4

14

1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-STD-883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

Unit

°C/W

°C/W

°C/W

Typical θJA is specified for a 4-layer printed circuit board (PCB)

with a solid ground plane. As shown in Table 7, airflow increases

heat dissipation, which reduces θJA. In addition, metal in direct

contact with the package leads from metal traces, through holes,

ground, and power planes reduces the θJA.

ESD CAUTION

Rev. E | Page 11 of 45

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