AD9250(Rev0) Ver la hoja de datos (PDF) - Analog Devices

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componentes Descripción

Fabricante

AD9250
(Rev.:Rev0)

14-Bit, 170 MSPS/250 MSPS, JESD204B, Dual Analog-to-Digital Converter

Analog Devices 

AD9250

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

ELECTRICAL

AVDD to AGND

DRVDD to AGND

DVDD to DGND

VIN+A/VIN+B, VIN−A/VIN−B to AGND

CLK+, CLK− to AGND

RFCLK to AGND

VCM to AGND

CS, PDWN to AGND

SCLK to AGND

SDIO to AGND

RST to DGND

FDA, FDB to DGND

SERDOUT0+, SERDOUT0−,

SERDOUT1+, SERDOUT1− to AGND

SYNCINB+, SYNCINB− to DGND

SYSREF+, SYSREF− to AGND

ENVIRONMENTAL

Operating Temperature Range

(Ambient)

Maximum Junction Temperature

Under Bias

Storage Temperature Range

(Ambient)

Rating

−0.3 V to +2.0 V

−0.3 V to +2.0 V

−0.3 V to +2.0 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.3 V

−0.3 V to AVDD + 0.3 V

−0.3 V to AVDD + 0.3 V

−0.3 V to DVDD + 0.3 V

−0.3 V to DVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DVDD + 0.3 V

−0.3 V to AVDD + 0.3 V

−40°C to +85°C

150°C

−65°C to +125°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Data Sheet

THERMAL CHARACTERISTICS

The exposed paddle must be soldered to the ground plane for

the LFCSP package. This increases the reliability of the solder

joints, maximizing the thermal capability of the package.

Table 7. Thermal Resistance

Package Type

Airflow

Velocity

(m/sec)

48-Lead LFCSP 0

7 mm × 7 mm 1.0

(CP-48-13)

2.5

θJA1, 2

25

22

20

θJC1, 3

2

θJB1, 4

14

1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-STD-883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

Unit

°C/W

°C/W

°C/W

Typical θJA is specified for a 4-layer printed circuit board (PCB)

with a solid ground plane. As shown in Table 7, airflow increases

heat dissipation, which reduces θJA. In addition, metal in direct

contact with the package leads from metal traces, through holes,

ground, and power planes reduces the θJA.

ESD CAUTION

Rev. 0 | Page 10 of 44

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