AD9239BCPZ-210 Ver la hoja de datos (PDF) - Analog Devices

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Fabricante

AD9239BCPZ-210

Quad, 12-Bit, 170 MSPS/210 MSPS/250 MSPS Serial Output 1.8 V ADC

Analog Devices 

AD9239

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Electrical

AVDD to AGND

DRVDD to DRGND

AGND to DRGND

AVDD to DRVDD

DOUT ± x to DRGND

SDO, SDI/SDIO, CLK± , VIN ± x,

VCMx, TEMPOUT, RBIAS to AGND

SCLK, CSB, PGMx, RESET,

PDWN to AGND

Environmental

Storage Temperature Range

Operating Temperature Range

Lead Temperature

(Soldering 10 sec)

Junction Temperature

Rating

−0.3 V to +2.0 V

−0.3 V to +2.0 V

−0.3 V to +0.3 V

−2.0 V to +2.0 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to AVDD + 0.3 V

−0.3 V to AVDD + 0.3 V

−65°C to +125°C

−40°C to +85°C

300°C

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Data Sheet

THERMAL RESISTANCE

The exposed paddle must be soldered to the ground plane for

the LFCSP package. Soldering the exposed paddle to the customer

board increases the reliability of the solder joints, maximizing

the thermal capability of the package.

Table 7. Thermal Resistance

Package Type

θJA

θJB θJC Unit

72-Lead LFCSP (CP-72-3)

16.2 7.9 0.6 °C/W

Typical θJA, θJB, and θJC values are specified for a 4-layer board in

still air. Airflow increases heat dissipation, effectively reducing

θJA. In addition, metal in direct contact with the package leads

from metal traces and through holes, ground, and power planes

reduces the θJA.

ESD CAUTION

Rev. E | Page 8 of 40

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