MP04HBT490-24 Ver la hoja de datos (PDF) - Dynex Semiconductor
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MP04HBT490-24 Datasheet PDF : 9 Pages
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MP04---490
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
temperature at 75˚C if full rated current is to be achieved. Power
dissipation may be calculated by use of VT(TO) and rT information
in accordance with standard formulae. We can provide
assistance with calculations or choice of heatsink if required.
The heatsink surface must be smooth and flat; a surface finish
of N6 (32µin) and a flatness within 0.05mm (0.002") are
recommended.
Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery, Scotch Brite or a mild chemical
etchant and then cleaned with a solvent to remove oxide build
up and foreign material. Care should be taken to ensure no
foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to ensure
optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or ‘T’ slots) in the heatsink.
Fit and finger tighten the recommended fixing bolts at each end.
Using a torque wrench, continue to tighten the fixing bolts by
rotating each bolt in turn no more than 1/4 of a revolution at a
time, until the required torque of 6Nm (55lbs.ins) is reached on
all bolts at both ends.
It is not acceptable to fully tighten one fixing bolt before starting
to tighten the others. Such action may DAMAGE the module.
POWER ASSEMBLY CAPABILITY
The Power Assembly group provides support for those
customers requiring more than the basic semiconductor switch.
Using CAD design tools the group has developed a flexible
range of heatsink / clamping systems in line with advances in
device types and the voltage and current capability of Dynex
semiconductors.
An extensive range of air and liquid cooled assemblies is
available covering the range of circuit designs in general use
today.
HEATSINKS
The Power Assembly group has a proprietary range of extruded
aluminium heatsinks. These were designed to optimise the
performance of Dynex semiconductors. Data with respect to air
natural, forced air and liquid cooling (with flow rates) is available
on request.
For further information on device clamps, heatsinks and
assemblies, please contact your nearest sales representative or
customer service office.
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www.dynexsemi.com
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