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EVAL-AD5765EBZ Ver la hoja de datos (PDF) - Analog Devices

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EVAL-AD5765EBZ Datasheet PDF : 28 Pages
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AD5765
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 5.
Parameter
AVDD to AGNDx, DGND
AVSS to AGNDx, DGND
DVCC to DGND
DVCC to AVDD
Digital Inputs to DGND
Digital Outputs to DGND
REFx to AGNDx, PGND
VOUTx to AGNDx
AGNDx to DGND
Operating Temperature Range (TA)
Industrial
Storage Temperature Range
Junction Temperature (TJ max)
Power Dissipation
Lead Temperature
Soldering
Rating
−0.3 V to +7 V
+0.3 V to −7 V
−0.3 V to +7 V
−DVCC to +0.25 V
−0.3 V to DVCC + 0.3 V or 7 V
(whichever is less)
−0.3 V to DVCC + 0.3 V
−0.3 V to AVDD + 0.3 V
AVSS to AVDD
−0.3 V to +0.3 V
−40°C to +105°C
−65°C to +150°C
150°C
(TJ max – TA)/θJA
JEDEC industry standard
J-STD-020
Data Sheet
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
θJA
θJC
Unit
32-Lead TQFP
65
12
°C/W
ESD CAUTION
Rev. C | Page 10 of 28

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