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EVAL-AD5764REBZ(RevD) Ver la hoja de datos (PDF) - Analog Devices

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EVAL-AD5764REBZ Datasheet PDF : 32 Pages
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AD5764R
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 4.
Parameter
AVDD to AGND, DGND
AVSS to AGND, DGND
DVCC to DGND
Digital Inputs to DGND
Digital Outputs to DGND
REFAB, REFCD to AGND, PGND
REFOUT to AGND
TEMP
VOUTx to AGND
AGND to DGND
Operating Temperature Range
Industrial
Storage Temperature Range
Junction Temperature (TJ max)
Lead Temperature (Soldering)
Rating
−0.3 V to +17 V
+0.3 V to −17 V
−0.3 V to +7 V
−0.3 V to (DVCC + 0.3 V) or +7 V,
whichever is less
−0.3 V to DVCC + 0.3 V
−0.3 V to AVDD + 0.3 V
AVSS to AVDD
AVSS to AVDD
AVSS to AVDD
−0.3 V to +0.3 V
−40°C to +85°C
−65°C to +150°C
150°C
JEDEC industry standard
J-STD-020
Data Sheet
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
32-Lead TQFP
65
12
°C/W
ESD CAUTION
Rev. D | Page 10 of 32

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