AD5111 Ver la hoja de datos (PDF) - Analog Devices
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AD5111 Datasheet PDF : 24 Pages
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AD5111/AD5113/AD5115
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter
VDD to GND
VLOGIC to GND
VA, VW, VB to GND
IA, IW, IB
Pulsed1
Frequency > 10 kHz
RAW = 5 kΩ and 10 kΩ
RAW = 80 kΩ
Frequency ≤ 10 kHz
RAW = 5 kΩ and 10 kΩ
RAW = 80 kΩ
Continuous
RAW = 5 kΩ and 10 kΩ
RAW = 80 kΩ
Digital Inputs U/D, CLK, and CS
Operating Temperature Range3
Maximum Junction Temperature (TJ Max)
Storage Temperature Range
Reflow Soldering
Peak Temperature
Time at Peak Temperature
Package Power Dissipation
Rating
–0.3 V to +7.0 V
–0.3 V to +7.0 V
GND − 0.3 V to VDD + 0.3 V
±6 mA/d2
±1.5 mA/d2
±6 mA/√d2
±1.5 mA/√d2
±6 mA
±1.5 mA
−0.3 V to +7 V or VDD + 0.3 V
(whichever is less)
−40°C to +125°C
150°C
−65°C to +150°C
260°C
20 sec to 40 sec
(TJ max − TA)/θJA
1 Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2 Pulse duty factor.
3 Includes programming of EEPROM memory.
Data Sheet
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is defined by JEDEC specification JESD-51, and the value is
dependent on the test board and test environment.
Table 7. Thermal Resistance
Package Type
8-Lead LFCSP
θJA
θJC
Unit
901
25
°C/W
1 JEDEC 2S2P test board, still air (0 m/sec air flow).
ESD CAUTION
Rev. B | Page 10 of 24
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