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ACPM-7822 Ver la hoja de datos (PDF) - Avago Technologies

Número de pieza
componentes Descripción
Fabricante
ACPM-7822 Datasheet PDF : 13 Pages
First Prev 11 12 13
Reflow Profile Recommendations
Tp
TL
Tsmax
Tsmin
ts
Preheat
tp
Ramp-up
tL
Critical Zone
TL to Tp
Ramp-down
25
t 25°C to Peak
Time
Typical SMT Reflow Profile for Maximum Temperature = 260 +0/ -5°C
Profile Feature
Sn-Pb Solder Pb-Free Solder
Average ramp-up rate (TL to TP)
3°C/sec max
3°C/sec max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
100°C
150°C
60-120 sec
150°C
200°C
60-180 sec
Tsmax to TL
– Ramp-up Rate
3°C/sec max
Time maintained above:
– Temperature (TL)
– Time (TL)
183°C
60-150 sec
217°C
60-150 sec
Peak temperature (Tp)
240 +0/-5°C
260 +0/-5°C
Time within 5°C of actual Peak Temperature (tp)
10-30 sec
20-40 sec
Ramp-down Rate
6°C/sec max
6°C/sec max
Time 25°C to Peak Temperature
6 min max.
8 min max.
Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C
11

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