ACPM-7355-TR1 Ver la hoja de datos (PDF) - Avago Technologies
Número de pieza
componentes Descripción
Fabricante
ACPM-7355-TR1 Datasheet PDF : 19 Pages
| |||
Application on mobile phone board
The figure 3 shows an application example in mobile. C5 and C6 should be placed close to pin4 and pin11. Bypass cap
C1, C2, C3 and C4 should be also placed nearby from pin2, pin3, pin5 and pin6, respectively. The length of post-PA trans-
mission line should be minimized to reduce line loss.
TX filter
C8
RF In Low
C1
PA_R0
PA_R1
PA_ON_Low Band
PA_ON _High Band
C4
C10
Coupler
C2
C11
ACPM-7355
L1
RF Out Low
Low IN
Vmode
Vbp
Vcc1
Ven_L
Ven_H
High IN
Low OUT
GND
GND
Vcc2
GND
GND
High OUT
output matching circuit
RF In High
C3
C5
C6
TX filter
C7
C9
C12
Coupler
C13
L2
RF Out High
VBATT
Figure 3. Peripheral Circuits
PCB layout and part placement on phone board
2
4
Figure 4. PCB guideline on phone board
11
1
Via hole
3
Notes:
1. To prevent voltage drop, make the bias lines as wide as
possible (Pink line).
2. Use many via holes to fence off PA RF input and output
traces for better isolation. Output signal of the PA should
be isolated from input signal and the receive signal. Output
signal should not be fed into PA input. (Green line)
3. Use via holes to connect outer ground plates to internal
ground planes. They help heat spread out more easily and
accordingly the board temperature can be lowered. They
also help to improve RF stability (Yellow square).
4. PA which has a ground slug requires many via holes which
go through all the layers (Red square).
Share Link: 