A42MX09-3TQG176I Ver la hoja de datos (PDF) - Microsemi Corporation

Número de pieza

componentes Descripción

Fabricante

A42MX09-3TQG176I

40MX and 42MX FPGA Families

Microsemi Corporation 

40MX and 42MX FPGA Families

0.50

0.45

0.40

PCI IOL Maximum

0.35

0.30

0.25

0.20

MX PCI IOL

0.15

0.10

PCI IOL Minimum

0.05

0.00

0

1

2

3

4

5

6

–0.05

–0.10

PCI IOH Maximum

MX PCI IOH

–0.15

–0.20

Voltage Out (V)

PCI IOH Minimum

Figure 1-15 • Typical Output Drive Characteristics (Based Upon Measured Data)

Junction Temperature (TJ)

The temperature variable in the Designer software refers to the junction temperature, not the ambient

temperature. This is an important distinction because the heat generated from dynamic power

consumption is usually hotter than the ambient temperature. EQ , shown below, can be used to calculate

junction temperature.

Junction Temperature = ΔT + Ta (1)

EQ 1

Where:

Ta = Ambient Temperature

ΔT = Temperature gradient between junction (silicon) and ambient

ΔT = θja * P (2)

P = Power

θja = Junction to ambient of package. θja numbers are located in Table 1-21 on page 1-26.

Revision 11

1- 25

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