317697-001 Ver la hoja de datos (PDF) - Intel

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317697-001

Gigabit Ethernet Controller

Intel 

82575 Gigabit Ethernet Controller Datasheet

2.7

Technology Features

Features

576-pin Flip-Chip Ball Grid Array (FC-BGA) package

Operating temperature:

1000BASE-T, 0 °C to 55 °C*

1000BASE-SX/LX (or SERDES backplane), 0 °C to 70 °C

Storage temperature 65 °C to 140 °C

Typical targeted power dissipation:

2.43 W @ D0 1000 Mbps

0.79 W @ D3cold 100 Mbps (wakeup enabled)

0.29 W @ D3cold (wakeup disabled)

Maxmum Payload Size: 128 and 256

Max number of transactions (TLP) supported on PCIe:

Four TX DMA requests + 1 TX descriptor + 1 RX

descriptor

Benefits

• 25 mm X 25 mm

• Simple thermal design

• Conditions: FF materials, nominal

voltage, 115 °C

• Minimizes impact of incorporating

Gigabit instead of Fast Ethernet.

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* For information about operating the 82575 outside of this range, please refer to the 82575 Thermal

Management Application Note.

9

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