74LVC1G07GV Ver la hoja de datos (PDF) - Philips Electronics
Número de pieza
componentes Descripción
Fabricante
74LVC1G07GV Datasheet PDF : 15 Pages
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Philips Semiconductors
Buffer with open-drain output
PACKAGE OUTLINES
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
Product specification
74LVC1G07
SOT353-1
D
y
Z
5
4
1
3
e
bp
e1
wM
E
A
X
c
HE
vM A
A2
A1
A
(A3)
θ
Lp
L
detail X
0
1.5
3 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(1)
e
e1
mm
1.1
0.1
0
1.0
0.8
0.15
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
0.65
1.3
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT353-1
MO-203
SC-88A
HE
L
Lp
v
w
y
Z(1)
θ
2.25
2.0
0.425
0.46
0.21
0.3
0.1
0.1
0.60
0.15
7°
0°
EUROPEAN
PROJECTION
ISSUE DATE
00-09-01
03-02-19
2004 Sep 07
11
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