74FST3245DW(2001) Ver la hoja de datos (PDF) - ON Semiconductor
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74FST3245DW Datasheet PDF : 8 Pages
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74FST3245
PACKAGE DIMENSIONS
–A–
–B–
P
L
0.25 (0.010) M T
R
U
G
QSOP–20
QS SUFFIX
CASE 492A–01
ISSUE O
Q
H x 45_
RAD.
0.013 X 0.005
DP. MAX
RAD.
0.005–0.010
TYP
DETAIL E
MOLD PIN
MARK
K
C
20 PL D
–T–
SEATING
PLANE
0.25 (0.010) M T B S A S
V
J
M
N 8 PL
F
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN
THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE
ONLY). BOTTOM PACKAGE DIMENSION SHALL
FOLLOW THE DIMENSION STATED IN THIS
DRAWING.
4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 6 MILS PER
SIDE.
5. BOTTOM EJECTOR PIN WILL INCLUDE THE
COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D.
INCHES
DIM MAX MIN
A 0.337 0.344
B 0.150 0.157
C 0.061 0.068
D 0.008 0.012
F 0.016 0.035
G 0.025 BSC
H 0.008 0.018
J 0.0098 0.0075
K 0.004 0.010
L 0.230 0.244
M
0_ 8_
N
0_ 7_
P 0.052 0.062
Q 0.035 DIA
R 0.035 0.045
U 0.035 0.045
V
0_ 8_
MILLIMETERS
MAX MIN
8.56 8.74
3.81 3.99
1.55 1.73
0.20 0.31
0.41 0.89
0.64 BSC
0.20 0.46
0.249 0.191
0.10 0.25
5.84 6.20
0_ 8_
0_ 7_
1.32 1.58
0.89 DIA
0.89 1.14
0.89 1.14
0_ 8_
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