5000 Ver la hoja de datos (PDF) - Intel

Número de pieza

componentes Descripción

Fabricante

5000

Dual-Core Intel® Xeon® Processor

Intel 

Contents

1 Introduction................................................................................................................. 9

1.1 Terminology ..................................................................................................... 11

1.2 State of Data .................................................................................................... 12

1.3 References ....................................................................................................... 12

2 Electrical Specifications ............................................................................................... 15

2.1 Front Side Bus and GTLREF ................................................................................ 15

2.2 Power and Ground Lands.................................................................................... 15

2.3 Decoupling Guidelines ........................................................................................ 16

2.3.1 VCC Decoupling...................................................................................... 16

2.3.2 VTT Decoupling ...................................................................................... 16

2.3.3 Front Side Bus AGTL+ Decoupling ............................................................ 16

2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 16

2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0]) .................................. 17

2.4.2 Phase Lock Loop (PLL) and Filter .............................................................. 18

2.5 Voltage Identification (VID) ................................................................................ 19

2.6 Reserved or Unused Signals................................................................................ 21

2.7 Front Side Bus Signal Groups .............................................................................. 21

2.8 GTL+ Asynchronous and AGTL+ Asynchronous Signals ........................................... 23

2.9 Test Access Port (TAP) Connection....................................................................... 23

2.10 Mixing Processors.............................................................................................. 24

2.11 Absolute Maximum and Minimum Ratings ............................................................. 24

2.12 Processor DC Specifications ................................................................................ 25

2.12.1 VCC Overshoot Specification .................................................................... 31

2.12.2 Die Voltage Validation ............................................................................. 32

3 Mechanical Specifications............................................................................................. 33

3.1 Package Mechanical Drawings ............................................................................. 33

3.2 Processor Component Keepout Zones................................................................... 37

3.3 Package Loading Specifications ........................................................................... 37

3.4 Package Handling Guidelines............................................................................... 38

3.5 Package Insertion Specifications.......................................................................... 38

3.6 Processor Mass Specifications ............................................................................. 38

3.7 Processor Materials............................................................................................ 38

3.8 Processor Markings............................................................................................ 39

3.9 Processor Land Coordinates ................................................................................ 40

4 Land Listing ............................................................................................................... 43

4.1 Dual-Core Intel Xeon Processor 5000 Series Land Assignments ............................... 43

4.1.1 Land Listing by Land Name ...................................................................... 43

4.1.2 Land Listing by Land Number ................................................................... 52

5

Signal Definitions ...................................................................................................... 61

5.1 Signal Definitions .............................................................................................. 61

6 Thermal Specifications ................................................................................................ 69

6.1 Package Thermal Specifications ........................................................................... 69

6.1.1 Thermal Specifications ............................................................................ 69

6.1.2 Thermal Metrology ................................................................................. 75

6.2 Processor Thermal Features ................................................................................ 77

6.2.1 Thermal Monitor..................................................................................... 77

6.2.2 On-Demand Mode .................................................................................. 77

6.2.3 PROCHOT# Signal .................................................................................. 78

6.2.4 FORCEPR# Signal................................................................................... 78

6.2.5 THERMTRIP# Signal ............................................................................... 78

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

3

Share Link: