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3SMAJ5913B(2007) Ver la hoja de datos (PDF) - Micro Commercial Components

Número de pieza
componentes Descripción
Fabricante
3SMAJ5913B
(Rev.:2007)
MCC
Micro Commercial Components MCC
3SMAJ5913B Datasheet PDF : 4 Pages
1 2 3 4
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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Features
Surface Mount Application
3.3 thru 56 Volt Voltage Range
Low Inductance,Low Profile Mounting
Glass Passivated Junction
High specified maximum current (IZM) when adequately heat sinking
Mechanical Data
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
0
Maximum temperature for soldering: 260 C for 10 seconds.
3SMAJ5913B
THRU
3SMAJ5943B
3.0 Watt
Surface Mount
Silicon
Zener Diodes

DO-214AC
(SMA) (LEAD F RAME)

H


J
Maximum Ratings @ 25oC Unless Otherwise Specified
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
Thermal
Resistance
Junction to Lead
VF
Pd
TJ, TSTG
RthJL
1.5V
3.0W
-55oC to
+150oC
25к/W
(Note: 1)
(Note: 2)
NOTES:
1. Forward Current @ 200mA.
2. Mounted on 5.0mm2 (.013mm thick) Iand areas.
Lead temperature at TL=75oC
A
C
E
F
G
D
B
DIMENSIONS
INCHES
MM
DIM
MIN
MAX
MIN
MAX
A
.079
.096
2.00
2.44
B
.050
.064
1.27
1.63
C
.002
.008
.05
.20
D
---
.02
---
.51
E
.030
.060
.76
1.52
F
.065
.091
1.65
2.32
G
.189
.220
4.80
5.59
H
.157
.181
4.00
4.60
J
.090
.115
2.25
2.92
SUGGESTED SOLDER
PAD LAYOUT
0.085 ”
MA X
NOTE
0.058 ”MI N
0.05
MI N
Revision: 3
www.mccsemi.com
1 of 4
2007/04/19

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