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32TSOP

PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm

Maxim Integrated 

Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate

is related to MTTF by:

MTTF = 1/Fr

NOTE: MTTF is frequently used interchangeably with MTBF.

The calculated failure rate for this device/process is:

FAILURE RATE:

MTTF (YRS): 37651

FITS: 3.0

The parameters used to calculate this failure rate are as follows:

Cf: 60%

Ea: 0.7

B: 0

Tu: 25 °C

Vu: 5.5

Volts

The reliability data follows. Some of the data in this report may be generic. A the start of this data is

a description of the assembly vehicle used to generate this reliability data. The next section is the

detailed reliability data for each stress. If there are additional assemblies used as part of this report,

a description of each will follow which includes the respective reliability data for that assembly.

Where appropriate, preconditioning is performed before all stresses and the bond crater test unless

otherwise noted. The reliability data section includes the latest data available.

Assembly Information:

Assembly Site:

Pin Count:

Package Type:

Body Size:

Mold Compound:

Lead Frame:

Lead Finsh:

Die Attach:

Bond Wire / Size:

Flammability:

Theta JA:

Theta JC:

Moisture Sensitivity

(JEDEC J-STD20A)

Date Code Range:

ASE

28

TSOP

8x13.4x0.965

Sumitomo G700

Stamped Alloy 42

Sn Plate 100% Matte

Sumitomo 1076 DS

Au / 1.0 mil

UL 94-V0

Level 3

0429 to 0429

PACKAGE TESTS

DESCRIPTION

DATE CODE CONDITION

READPOINT

QTY FAILS FA#

SOLDERABILITY

0429

JESD22-B102

Total:

15

0

0

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