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TC3400VPA

+1.8V, Low Power, 16-Bit Sigma-Delta A/D Converter

Microchip Technology 

TC3400

TC3400 DC ELECTRICAL SPECIFICATIONS (CONTINUED)

Electrical Characteristics: TA = 25°C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for

temperatures of 0°C to 85°C. VREF = 1.25V, Internal Clock Frequency = 520kHz.

Symbol

Parameter

Min

Typ

Max

Unit

Test Conditions

SCLK

VIL

VIH

ILEAK

SDAT

Input Low Voltage

Input High Voltage

Leakage Current

—

—

0.7 x VDD

—

—

1

VOL

Output Low Voltage

—

—

VOH

Output High Voltage (SDAT)

0.9 x VDD

—

Note 1: Differential input voltage defined as (VIN+ – VIN-).

2: Resistance from INn+ to INn- or INn to GND.

3: @ VDD = 1.8V, ISOURCE ≤ 200µA.

0.3 x VDD

V

—

V

—

µA

0.4

V IOL = 1.5mA

—

V ISOURCE = 400µA (Note 3)

TC3400 AC ELECTRICAL SPECIFICATIONS

Electrical Characteristics: TA = 25°C and VDD = 2.7V, unless otherwise specified. Boldface type specifications apply for

temperatures of 0°C to 85°C. VREF = 1.25V, Internal Clock Frequency = 520kHz.

Symbol

Parameter

Min

Typ

Max Unit

Test Conditions

t1

Resolution Reduction Clock Width

1

—

—

µsec Width of SCLK (Negative)

t2

Resolution Reduction Clock Width

1

—

—

µsec Width of SCLK (Positive)

t3

Conversion Time (15-bit Plus Sign) —

125

—

msec 16-bit Conversion, TA = 25°C (Note 1)

Conversion Time (14-bit Plus Sign) —

t3/2.0

—

msec 15-bit Conversion

Conversion Time (13-bit Plus Sign) —

t3/4.0

—

msec 14-bit Conversion

Conversion Time (12-bit Plus Sign) —

t3/7.8

—

msec 13-bit Conversion

Conversion Time (11-bit Plus Sign) —

t3/15.1

—

msec 12-bit Conversion

Conversion Time (10-bit Plus Sign) —

t3/28.6

—

msec 11-bit Conversion

Conversion Time (9-bit Plus Sign)

—

t3/51.4

—

msec 10-bit Conversion

t4

Resolution Reduction Window

—

t3/85.7

—

msec Width of SCLK

t5

SCLK to Data Valid

1000

—

—

nsec SCLK Falling Edge to SDAT Valid

t8

Acknowledge Delay

—

—

1000 nsec SCLK to SDAT Delay

Note 1: Nominal temperature drift is -2830ppm/C° for temperature less than 25°C and -1340ppm/°C for temperatures

greater than 25°C.

DS21409B-page 4

© 2002 Microchip Technology Inc.

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