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ADG712BRU Ver la hoja de datos (PDF) - Analog Devices

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ADG712BRU Datasheet PDF : 16 Pages
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ABSOLUTE MAXIMUM RATINGS
TA = +25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to GND
Analog, Digital Inputs1
−0.3 V to +6 V
−0.3 V to VDD +0.3 V or
30 mA, whichever occurs
first
Continuous Current, S or D
30 mA
Peak Current, S or D
100 mA (Pulsed at 1 ms,
10% duty cycle maximum)
Operating Temperature Range
−40°C to +85°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
150°C
TSSOP Package, Power Dissipation 430 mW
θJA Thermal Impedance
150°C/W
θJC Thermal Impedance
27°C/W
SOIC Package, Power Dissipation 520 mW
θJA Thermal Impedance
125°C/W
θJC Thermal Impedance
42°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
Soldering(Pb-Free)
Reflow, Peak Temperature
260(+0/−5)°C
Time at Peak Temperature
20 sec to 40 sec
ESD
2 kV
1 Overvoltages at IN, S or D will be clamped by internal diodes. Currents
should be limited to the maximum ratings given.
ADG711/ADG712/ADG713
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
ESD CAUTION
Rev. B | Page 5 of 16

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