28F002BC Ver la hoja de datos (PDF) - Intel
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28F002BC Datasheet PDF : 37 Pages
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28F002BC 2-MBIT BOOT BLOCK FLASH MEMORY
E
3.7 Power Supply Decoupling
Flash memory’s power switching characteristics
require careful device decoupling methods. System
designers should consider three supply current
issues:
1. Standby current levels (ICCS)
2. Active current levels (ICCR)
3. Transient peaks produced by falling and rising
edges of CE#
Transient current magnitudes depend on the device
outputs’ capacitive and inductive loading. Two-line
control and proper decoupling capacitor selection
will suppress these transient voltage peaks. Each
flash device should have a 0.1 µF ceramic
capacitor connected between each VCC and GND,
and between its VPP and GND. These high-
frequency, inherently low-inductance capacitors
should be placed as close as possible to the
package leads.
3.7.1
VPP TRACE ON PRINTED CIRCUIT
BOARDS
Designing for in-system writes to the flash memory
requires special consideration of the VPP power
supply trace by the printed circuit board designer.
The VPP pin supplies the flash memory cells current
for programming and erasing. One should use
similar trace widths and layout considerations given
to the VCC power supply trace. Adequate VPP
supply traces and decoupling capacitors placed
adjacent to the component will decrease spikes and
overshoots.
24
PRELIMINARY
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