HMMC-5021 Ver la hoja de datos (PDF) - HP => Agilent Technologies

Número de pieza

componentes Descripción

Fabricante

HMMC-5021

2– 26.5 GHz GaAs MMIC Traveling Wave Amplifier

HP => Agilent Technologies 

Figure 2. HMMC-5021/22/26 Bonding Pad Locations.

Notes:

All dimensions in microns.

Rectangular Pad Dim: 75 x 75 µm.

Octagonal Pad Dim: 90 µm dia.

All other dimensions ±5 µm

(unless otherwise noted).

Chip thickness: 127 ± 15 µm.

1.5 mil dia.Gold Wire

Bond to ≥15 nF

DC Feedthru

≥4 nH Inductor

(0.7 mil Gold Wire Bond

with length ≥150 mils)

≥68 pF Capacitor

Input and Output Thin Film

Circuit with ≥8 pF

DC Blocking Capacitor

Trace Offset

168 µm

(6.6 mils)

Gold Plated Shim

2.0 mil

nom. gap

VDD

OUT

IN

VG1

2.0 mil

nom. gap

0.7 mil dia. Gold Bond Wire

(Length NOT important)

Trace Offset

168 µm

(6.6 mils)

Bonding Island

1.5 mil dia.Gold Wire

Bond to ≥15 nF DC Feedthru

Note:

Total offset between RF input

and RF output pad is 335 µm

(13.2 mils).

Figure 3. HMMC-5021/22/26 Assembly Diagram.

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