1812L014 Ver la hoja de datos (PDF) - Littelfuse, Inc

Número de pieza

componentes Descripción

Fabricante

1812L014

POLY-FUSE® Resettable PTCs Surface Mount > 1812L Series

Littelfuse, Inc 

POLY-FUSE® Resettable PTCs

Surface Mount > 1812L Series

Temperature Rerating Curve

170%

150%

130%

110%

90%

70%

50%

30%

10%

-40 -30 -20 -10

0 10 20 30 40 50 60 70 80 85

Temperature (°C)

Physical Specifications

Terminal Material

Lead Solderability

Solder-Plated Copper (Solder Material:

Matte Tin (Sn))

Meets EIA Specification RS186-9E, ANSI/

J-STD-002 Category 3.

Environmental Specifications

Operating/Storage Temp. -40°C to +85°C

Max. Device Surface Temp.

in Tripped State

125°C

Passive Aging

+85°C, 1000 hours

-/+5% typical resistance change

Humidity Aging

+85°C, 85% R.H.,1000 hours

-/+5% typical resistance change

Thermal Shock

MIL–STD–202, Method 107G

+85°C/-40°C 20 times

-30% typical resistance change

Solvent Resistance

MIL–STD–202, Method 215,

No change

Vibration

MIL–STD–883C, Method 2007.1,

Condition A, No change

Moisture Level Sesitivity Level 1, J–STD–020C

Soldering Parameters

Condition

Reflow

Peak Temp/ Duration Time

260°C / 10 Sec

Time above liquids (TAL) 220°C

60 Sec ~ 100 Sec

Preheat 120°C~ 180°C

Storage Condition

50 Sec ~ 150 Sec

0°C~35°C, <=70%RH

• Recommended reflow methods: IR, vapor phase oven, hot air

oven, N2 environment for lead–free

• R ecommended maximum paste thickness is 0.25mm (0.010 inch)

• D evices can be cleaned using standard industry methods and

solvents.

Note: If reflow temperatures exceed the recommended profile,

devices may not meet the performance requirements.

Soldering

260

220

Preheating

180

120

Cooling

0

50 to 150

60 to 100

120

Time(s)

© 2013 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 11/05/13

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