RC1117X25 Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
RC1117X25 Datasheet PDF : 9 Pages
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PRODUCT SPECIFICATION
RC1117
Pin Assignments
Tab is
VOUT
Front View
3
2
1
IN
OUT
ADJ/GND
4-Lead Plastic SOT-223
ΘJC = 15°C/W*
Tab is
VOUT
123
ADJ/
IN
GND
3-Lead Plastic TO-252
ΘJC = 3°C/W*
Tab is
VOUT
1
2
3
ADJ/ OUT IN
GND
3-Lead Plastic TO-263
ΘJC = 3°C/W*
*With package soldered to 0.5 square inch copper area over backside ground plane or internal power plane., ΘJA can vary from
30°C/W to more than 50°C/W. Other mounting techniques may provide better thermal resistance than 30°C/W.
Absolute Maximum Ratings
Parameter
VIN
Operating Junction Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10 sec.)
Min.
Max.
Unit
7.5
V
0
125
°C
-65
150
°C
300
°C
2
REV. 1.3.0 3/28/02
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