5162ISZ Ver la hoja de datos (PDF) - Intersil
Número de pieza
componentes Descripción
Fabricante
5162ISZ Datasheet PDF : 18 Pages
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EL5162, EL5163, EL5262, EL5263, EL5362
Typical Performance Curves (Continued)
0
-10
VS+ = +5V
VS- = -5V
-20
AV = +2
RL = 150Ω
-30
-40
-50
-60
-70
-80
-90
-100100
1k
10k 100k 1M
FREQUENCY (Hz)
10M 100M
FIGURE 13. PSRR (VS-) vs FREQUENCY
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.4
1.2 1.250W
1.0
0.8 909mW
SO16 (0.150”)
JA = +80°C/W
0.6
SO8
JA = +110°C/W
0.4
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 14. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.4
1.2
1.0 893mW
0.8
0.6
QSOP16
JA = +112°C/W
0.4
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 15. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.50
0.45 435mW
0.40
0.35
SOT23-5/6
0.30
JA = +230°C/W
0.25
0.20
0.15
0.10
0.05
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 16. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.0
0.9 870mW
0.8
0.7
MSOP8/10
0.6
JA = +115°C/W
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75 85 100
125
AMBIENT TEMPERATURE (°C)
FIGURE 17. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
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8
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.0
0.9
0.8 909mW
0.7
SO16 (0.15 0”)
JA = +110°C/W
0.6 625mW
0.5
0.4
SO8
0.3
JA = +160°C/W
0.2
0.1
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 18. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FN7388.12
April 6, 2015
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