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EL5162(2005) Ver la hoja de datos (PDF) - Intersil

Número de pieza
componentes Descripción
Fabricante
EL5162 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
EL5162, EL5163, EL5262, EL5263, EL5362
Typical Performance Curves (Continued)
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.2
1
0.8
633mW
0.6
0.4
QSOP16
θJA=158°C/W
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.6
0.5 486mW
0.4
MSOP8/10
θJA=206°C/W
0.3
0.2
0.1
0
0
25
50
75 85 100
125
AMBIENT TEMPERATURE (°C)
FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.45
0.4 391mW
0.35
0.3
SOT23-5/6
0.25
θJA=256°C/W
0.2
0.15
0.1
0.05
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
9
FN7388.7
September 8, 2005

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