EL5162(2005) Ver la hoja de datos (PDF) - Intersil
Número de pieza
componentes Descripción
Fabricante
EL5162 Datasheet PDF : 9 Pages
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EL5162, EL5163, EL5262, EL5263, EL5362
Typical Performance Curves (Continued)
0
VCC = +5V
-10 VEE = -5V
-20
AV = +2
RL = 150Ω
-30
-40
-50
-60
-70
-80
-90
-100
100 1K
10K 100K 1M
FREQUENCY (Hz)
10M 100M
FIGURE 13. PSRR (VEE)
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.4
1.2
1 893mW
0.8
0.6
QSOP16
θJA=112°C/W
0.4
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 15. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1
0.9 870mW
0.8
0.7
MSOP8/10
0.6
θJA=115°C/W
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75 85 100
125
AMBIENT TEMPERATURE (°C)
FIGURE 17. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.4
1.2 1.250W
1
0.8 909mW
SO16 (0.150”)
θJA=80°C/W
0.6
SO8
θJA=110°C/W
0.4
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 14. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.5
0.45 435mW
0.4
0.35
SOT23-5/6
0.3
θJA=230°C/W
0.25
0.2
0.15
0.1
0.05
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 16. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1
0.9
909mW
0.8
0.7
SO16 (0.150”)
θJA=110°C/W
0.6 625mW
0.5
0.4
SO8
0.3
θJA=160°C/W
0.2
0.1
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 18. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
8
FN7388.7
September 8, 2005
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