MPC7447A Ver la hoja de datos (PDF) - Freescale Semiconductor

Número de pieza

componentes Descripción

Fabricante

MPC7447A

RISC Microprocessor Hardware Specifications

Freescale Semiconductor 

Package Description

8.3 Package Parameters for the MPC7447A, 360 HCTE LGA

The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360 high

coefficient of thermal expansion ceramic land grid array (HCTE).

Package outline

Interconnects

Pitch

Minimum module height

Maximum module height

Coefficient of thermal expansion

25 × 25 mm

360 (19 × 19 ball array – 1)

1.27 mm (50 mil)

1.92 mm

2.20 mm

12.3 ppm/°C

MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5

Freescale Semiconductor

29

Share Link: