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AD8271BRMZ-R7 Ver la hoja de datos (PDF) - Analog Devices

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AD8271BRMZ-R7 Datasheet PDF : 20 Pages
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AD8271
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
Output Short-Circuit Current
Input Voltage Range
Storage Temperature Range
Specified Temperature Range
Package Glass Transition Temperature (TG)
ESD
Human Body Model
Charge Device Model
Machine Model
Rating
±18 V
See derating curve in
Figure 2
+VS + 0.4 V to
−VS − 0.4 V
−65°C to +130°C
−40°C to +85°C
150°C
1 kV
1 kV
0.1 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 6. Thermal Resistance
Package Type
θJA
θJC
10-Lead MSOP
141.9 43.7
Unit
°C/W
The θJA values in Table 6 assume a 4-layer JEDEC standard
board with zero airflow.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8271 is limited
by the associated rise in junction temperature (TJ) on the die. At
approximately 150°C, which is the glass transition temperature,
the properties of the plastic change. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric perfor-
mance of the amplifiers. Exceeding a temperature of 150°C for
an extended period of time can cause changes in silicon devices,
potentially resulting in a loss of functionality.
The AD8271 has built-in short-circuit protection that limits
the output current to approximately 100 mA (see Figure 22 for
more information). Although the short-circuit condition itself
does not damage the part, the heat generated by the condition
can cause the part to exceed its maximum junction temperature,
with corresponding negative effects on reliability.
1.6
1.4
TJ MAX = 150°C
1.2
1.0
0.8
0.6
0.4
0.2
0
–50 –25
0
25
50
75
100 125
AMBIENT TEMPERATURE (C)
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. 0 | Page 6 of 20

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