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MAX44241 Ver la hoja de datos (PDF) - Maxim Integrated

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MAX44241 Datasheet PDF : 12 Pages
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MAX44246
36V, Low-Noise, Precision, Dual Op Amp
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VDD to GND) ..............................-0.3V to +40V
All Other Pins.................................(GND - 0.3V) to (VDD + 0.3V)
Short-Circuit Duration, OUTA,
OUTB to Either Supply Rail………………………….............. 1s
Continuous Input Current (Any Pin) ...................................20mA
Differential Input Current.................................................. Q20mA
Differential Input Voltage (Note 1)........................................ .Q6V
Continuous Power Dissipation (TA = +70NC)
8-Pin FMAX (derate 4.8mW/C above +70NC)..........387.8mW
8-Pin SO (derate 4.8mW/C above +70NC)...............470.6mW
Operating Temperature Range......................... -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering,10s)..................................+300NC
Soldering Temperature (reflow).......................................+260NC
Note 1: The amplifier inputs are connected by internal back-to-back clamp diodes. In order to minimize noise in the input stage,
current-limiting resistors are not used. If differential input voltages exceeding ±1V are applied, limit input current to 20mA.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
µMAX
Junction-to-Ambient Thermal Resistance (qJA).........221NC/W
Junction-to-Case Thermal Resistance (qJC) ...............42NC/W
SO
Junction-to-Ambient Thermal Resistance (qJA).........120NC/W
Junction-to-Case Thermal Resistance (qJC) ...............37NC/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VDD = 30V, VGND = 0V, VIN+ = VIN- = VDD/2, RL = 5kΩ to VDD/2, TA = -40°C to +125°C, unless otherwise noted. Typical values at
TA = +25°C.) (Note 3)
PARAMETER
Supply Voltage Range
Power-Supply Rejection Ratio
(Note 4)
Quiescent Current per Amplifier
Power-Up Time
DC SPECIFICATIONS
Input Common-Mode Range
Common-Mode Rejection Ratio
(Note 4)
Input Offset Voltage (Note 4)
Input Offset Voltage Drift
(Note 4)
Input Bias Current (Note 4)
SYMBOL
VDD
PSRR
IDD
tON
CONDITIONS
Guaranteed by PSRR
VDD = 2.7V to 36V, TA = +25NC
VDD = 2.7V to 36V, -40NC < TA < +125NC
RL = J
TA = +25NC
-40NC < TA < +125NC
VCM Guaranteed by CMRR test
CMRR
VOS
VCM = (VGND + 0.05V) to (VDD - 1.5V)
TC VOS
IB
TA = +25NC
-40NC < TA < +125NC
MIN TYP MAX UNITS
2.7
36
V
148
166
dB
146
0.42 0.55
mA
0.60
20
Fs
VGND - 0.05 VDD - 1.5
V
146
166
dB
1
5
FV
1
20
nV/NC
300
600
pA
1250
Maxim Integrated
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