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BU-61582

SPACE LEVEL MIL-STD-1553 BC/RT/MT ADVANCED COMMUNICATION ENGINE (SP’ACE) TERMINAL

Unspecified 

RADIATION HARDNESS

The BU-61582 combines analog bipolar transceivers with logic

and RAM fabricated by Honeywell Solid State Electronics

Center’s (SSEC) 0.8 micron Radiation Insensitive CMOS (RIC-

MOS-4) process to provide radiation survivability.

To summarize, the BU-61582 has a total gamma dose immunity

of 1 MRad and a LET threshold of 59 MeV/mg/cm2, providing a

soft error rate of 3.6 x 10-5 errors/device-day. Since the trans-

ceiver is bipolar and the digital logic and RAM is implemented in

Honeywell’s RICMOS process, the hybrids are inherently

immune to latchup.

HIGH-REL SCREENING

DDC is committed to the design and manufacture of hybrids and

transformers with enhanced processing and screening for space-

borne applications and other systems requiring the highest lev-

els of reliability. These platforms include launch vehicles, satel-

lites and the International Space Station.

DDC has tailored its design methodologies to optimize the fabri-

cation of space level hybrids. The intent of the design guidelines

is to minimize the number of die and wirebonds, minimize the

number of substrate layers, and maximize the space between

components. DDC’s space grade products combine analog bipo-

lar and rad hard CMOS technology to provide various levels of

radiation tolerance.

The BU-61582 is packaged in a 70-pin ceramic package. In con-

trast to Kovar (metal) packages, the use of ceramic eliminates

the hermeticity problems associated with the glass beads used

in the metal packages. In addition, ceramic packages provide

more rigid leads, better thermal properties, easier wirebonding,

and lower weight.

The production of the space level hybrids can entail enhanced

screening steps beyond DDC’s standard flow. This includes

Condition A visual inspection, SEM analysis, and element evalu-

ation for all integrated circuit die. For the hybrids, additional

screening includes Particle Impact Noise Detection (PIND), 320-

hour burn-in, 100% non-destructive wirebond pull, X-ray analy-

sis, as well as Destructive Physical Analysis (DPA) testing,

extended temperature cycling for QCI testing, and a moisture

content limit of 5000 PPM. TABLE 3 summarizes the procure-

ment screening, element evaluation, and hybrid screening used

in the production of the BU-61582.

TABLE 2. SP’ACE SERIES RADIATION

SPECIFICATIONS

PART

NUMBER

TOTAL

DOSE

SINGLE EVENT

UPSET

SINGLE EVENT

LATCHUP

BU-61582(3)X0

BU-61582(3)X1

BU-61582(3)X2

1 MRad

3.6 x 10-5

errors/device-day,

(LET Threshold of

59 MeV/mg/cm2)

Immune

BU-61582(3)X3

100 KRad

BU-61582(3)X6

3.6 x 10-5

errors/device-day,

(LET Threshold of

59 MeV/mg/cm2)

Immune

TABLE 3. HIGH RELIABILITY SCREENING OPTIONS

ELEMENT EVALUATION

METHOD

Visual Inspection:

Integrated Circuits

Transistors & Diodes

Passive Components

MIL-STD-883, Method 2010 Condition A

MIL-STD-750, Method 2072 and 2073

MIL-STD-883, Method 2032 Class S

SEM Analysis for Integrated MIL-STD-883, Method 2018

Circuits

Element Evaluation:

Visual,

Electrical,

Wire Bondability,

24-Hour Stabilization Bake,

10 Temperature Cycles

5000 g’s constant acceleration MIL-H-38534

240-Hour Powered Burn-In

and 1000-Hour Life Test

(Burn-In and 1000-Hour Life

Test Are Only Required For

Active Components.)

ASSEMBLY & TEST

Particle Impact Noise

Detection (PIND)

MIL-STD-883, Method 2020 Condition A

320-Hour Burn-In

MIL-STD-883, Method 1015

100% Non-Destructive

Wirebond Pull

MIL-STD-883, Method 2023

Radiographic (X-Ray)

Analysis

MIL-STD-883, Method 2012

QCI TESTING

Extended Temperature

Cycling:

20 Cycles Including

Radiographic (X-Ray)

Testing

MIL-STD-883, Method 1010 Condition C

and MIL-STD-883, Method 2012

Moisture Content Limit of

5000 PPM

MIL-STD-883, Method 1018

Data Device Corporation

www.ddc-web.com

6

BU-61582

M-08/04-0

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