MP03HBP360-12 Ver la hoja de datos (PDF) - Dynex Semiconductor
Número de pieza
componentes Descripción
Fabricante
MP03HBP360-12 Datasheet PDF : 9 Pages
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MP03XXX360
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
42.5
Ø5.5
35
28.5
5
K2
1
2
3 G2
G1
K1
3x M8
80
115
2.8x0.8
92
Recommended fixings for mounting: M5 socket head cap screws.
Nominal weight: 950g
Auxiliary gate/cathode leads are not supplied but may be purchsed separately.
Module outline type code: MP03
7/9
www.dynexsemi.com
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