MP03HBP360-08(2002) Ver la hoja de datos (PDF) - Dynex Semiconductor
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MP03HBP360-08 Datasheet PDF : 8 Pages
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MP03XXX360
PACKAGE DETAILS
For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
42.5
35
28.5
Ø5.5
5
1
2
3x M8
80
115
K2
3 G2
G1
K1
K2 G2
1
2
3
Circuit type: HBN
G1 K1
2.8x0.8 1
2
3
Circuit type: HBP
G1 K1 K2 G2
1
2
3
Circuit type: HBT
92
Recommended fixings for mounting: M5 socket head cap screws.
Nominal weight: 950g
Auxiliary gate/cathode leads are not supplied but may be purchsed separately.
Module outline type code: MP03
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
temperature at 75˚C if full rated current is to be achieved. Power
dissipation may be calculated by use of VT(TO) and rT information
in accordance with standard formulae. We can provide
assistance with calculations or choice of heatsink if required.
The heatsink surface must be smooth and flat; a surface finish
of N6 (32µin) and a flatness within 0.05mm (0.002") are
recommended.
Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery, Scotch Brite or a mild chemical
etchant and then cleaned with a solvent to remove oxide build
up and foreign material. Care should be taken to ensure no
foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to ensure
optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or ‘T’ slots) in the heatsink.
Fit and finger tighten the recommended fixing bolts at each end.
Using a torque wrench, continue to tighten the fixing bolts by
rotating each bolt in turn no more than 1/4 of a revolution at a
time, until the required torque of 6Nm (55lbs.ins) is reached on
all bolts at both ends.
It is not acceptable to fully tighten one fixing bolt before starting
to tighten the others. Such action may DAMAGE the module.
7/8
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