MP03HBT360-08(2002) Ver la hoja de datos (PDF) - Dynex Semiconductor
Número de pieza
componentes Descripción
Fabricante
MP03HBT360-08 Datasheet PDF : 8 Pages
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MP03XXX360
1400
1200
0.04
0.02 Rth(hs-a) ˚C/W
1000
0.08
800
0.10
600
0.12
0.15
400
0.20
0.30
0.40
200
R - Load
L - Load
0
0
20
40
60
80
100 120
0
Maximum ambient temperature - (˚C)
200
400
600
D.C. output current - (A)
Fig. 11 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for
various values of heatsink thermal resistance
(Note: R values given above are true heatsink thermal resistances to ambient and already account for R module contact thermal)
th(hs-a)
th(c-hs)
1200
0.08
1000
0.04 0.02 Rth(hs-a) ˚C/W
R & L- Load
800
0.10
0.12
600
0.15
0.20
400
0.30
200
0.40
0
0
20
40
60
80
100 120
0
Maximum ambient temperature - (˚C)
200
400
600
D.C. output current - (A)
Fig. 12 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for
various values of heatsink thermal resistance
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal)
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